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TrustFinance Global Insights
Mei 13, 2026
2 min read
155

UBS analysts forecast that Samsung Electronics is on a trajectory to match SK Hynix's market share in the High-Bandwidth Memory (HBM) sector by the year 2027. This projection is underpinned by continued strong demand for artificial intelligence chips and Samsung's strategic capital investments.
The report highlights the escalating competition within the semiconductor industry, specifically for HBM which is a critical component for AI accelerators. UBS reiterated its HBM shipment forecast for Samsung for 2026 at 9.7 billion gigabits, marking a 124% year-over-year growth. Furthermore, analysts revised the 2027 estimate upwards to 23 billion gigabits, a significant 137% year-on-year increase, citing Samsung's recent capital expenditure pull-ins as a primary driver.
This development signals a potential rebalancing of power in the HBM market, which could influence stock valuations and supply chain strategies for companies reliant on AI hardware. Samsung's aggressive investment approach demonstrates its commitment to capturing a larger slice of the high-growth AI chip market, directly challenging the current leadership position held by SK Hynix.
In summary, Samsung is positioned to achieve market share parity with SK Hynix in HBM production by 2027. Market watchers and investors will be closely monitoring the company's capital deployment and production outputs as key indicators of its progress in this highly competitive technology race.
Q: Why did UBS raise its 2027 HBM shipment forecast for Samsung?
A: UBS analysts raised the forecast primarily due to Samsung's recent capital expenditure pull-ins, indicating accelerated investment in production capacity to meet strong AI-driven demand.
Q: What is High-Bandwidth Memory (HBM)?
A: HBM is a high-performance memory standard essential for advanced AI accelerators and graphics cards, providing the high-speed data access required for complex computational tasks.
Source: Investing.com

TrustFinance Global Insights
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