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TrustFinance Global Insights
Mar 19, 2026
2 min read
18

Samsung Electronics reportedly plans to supply its next-generation HBM4 memory chips to OpenAI for its first custom artificial intelligence processor, according to the Korean Economic Daily. This move is part of a broader strategy to meet the rising demand for OpenAI's advanced computing needs, including its Stargate project.
According to unnamed industry sources, Samsung is slated to supply up to 800 million gigabits of 12-layer HBM4 chips in the second half of this year. These chips are intended for OpenAI's new AI processor, which was developed in collaboration with Broadcom and is expected to be manufactured by Taiwan Semiconductor Manufacturing Co (TSMC). Production is anticipated to begin in the third quarter for a year-end launch.
This potential deal solidifies Samsung's crucial role in the AI hardware supply chain, intensifying competition in the high-bandwidth memory sector. The company is also expanding its partnerships, having recently signed a memorandum of understanding with Advanced Micro Devices (AMD) to supply HBM4 chips for its upcoming AI GPUs. Samsung and OpenAI have not officially commented on the report.
The reported partnership underscores the critical importance of securing high-performance memory for AI development. As demand for generative AI services grows, strategic alliances between chipmakers and AI firms will be a key factor in market leadership. The industry now awaits official confirmation and further details on the collaboration.
Q: What are HBM4 chips?
A: High-Bandwidth Memory 4 (HBM4) is the next generation of high-performance RAM, crucial for providing the speed and data throughput required by advanced AI accelerators and GPUs.
Q: Which companies are involved in OpenAI's custom chip?
A: The project involves OpenAI as the end-user, Broadcom as a co-developer, TSMC as the manufacturer, and Samsung as the reported HBM4 chip supplier.
Source: Investing.com

TrustFinance Global Insights
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